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Edgewater and CMC Wireless Accelerate Commercialization of High Density, Wi-Fi Technology
Edgewater and CMC announced a Memorandum of Understanding (MOU) for expanded technology sharing of Edgewater’s Spectrum Slicing technology for the next-generation, high density, Wi-Fi solutions. The goal of this agreement is to accelerate the commercialization of Edgewater’s Spectrum Slicing silicon solutions for use in IoT applications. [more]